Hasso-Plattner-Institut20 Jahre HPI
Hasso-Plattner-Institut20 Jahre HPI


The HPI Future SOC Lab provides hardware and software for researchers in cooperation with four industry partners. To gain access to the technologies listed below, you must first submit a project proposal (further information).

You will receive your access information directly after the project approval email in the days following HPI Future SOC Lab Day. Researchers get access for about 6 months. For the creation of the user accounts the Lab needs the signed Terms of Use (by the Principle Investigator) and a user list. At the end of a period, all project accesses and data are deleted.

Further information: Project Steps

Industry partners

[Translate to Englisch:] Hewlett Packard Enterprise
[Translate to Englisch:] Dell EMC
[Translate to Englisch:] Fujitsu
[Translate to Englisch:] SAP

Compute Power

High-RAM Multicore Machines

  • DL980 (80 CPU cores, 2 TiB RAM)

  • DL560 (80 CPU cores, 1.5 TiB RAM)

Distributed Computing

  • 1000-Core cluster

    • 25 Nodes

    • Each 40 CPU cores, 1 TiB RAM

  • HP CC

    • 32 Blades

  • Moonshot

    • 10 cartridges
    • Each 8 cores, 64 GiB RAM

GPU Power


  • 2 Intel Xeon Phi 5110p (8 GiB)

Nvidia K GPU

  • K20/K80 (HP/SuperMicro)

Nvidia DGX-1

  • Tesla V100
  • 1000 Terraflop
  • 40960 Cores

Storage and Backup

Dell EMC

  • VNX 5300, VNX 5700, VNX 5800
  • ~300 TiB HDD Storage

HP 3PAR (as part of HP CC)

  • ~40 TiB HDD Storage


  • Dell EMC VNXe 3300, Infortrend EonStor GS 2000
  • ~50 TiB


  • Dell EMC DataDomain
  • ~50 TiB Backup Storage


10G/40G interconnect

  • Fujitsu and Brocade Switches

    • 10G Server and Storage connection
    • Internet uplink via X-WiN of DFN (German Research Network)

  • Core switch with 40G Router interconnect


We offer single HANA installations on shared hardware. For these purposes we have the following hardware available:

Fujitsu PQ2800

  • CPU: 8 x Xeon E7-8850
  • RAM: 2048 GB
  • HDD: 2048 GB
  • HBA: Intel X540-T2 10 GB Ethernet

Fujitsu RX900 S1

  • CPU: 8 x Xeon X7560
  • RAM: 1024 GB
  • HDD: 6 x 900 GB
  • SSD: Fusion-io ioDimm3, 1280 GB
  • HBA: Emulex 8Gb Fibre Channel

Hewlett Packard DL980 G7

  • CPU: 4 x Xeon (Nehalem EX) X7560
  • RAM: 1024 GB
  • HDD: 2 x 300 GB
  • SSD: Fusion-io ioDimm3, 1280 GB
  • HBA: Emulex 8Gb Fibre Channel