Hasso-Plattner-Institut25 Jahre HPI
Hasso-Plattner-Institut25 Jahre HPI
Login
 

Ausstattung

Das HPI Future SOC Lab stellt in Zusammenarbeit mit den Industriepartnern Hewlett Packard Enterprise, Dell EMC, Fujitsu, SAP und SUSE Forschern eine heterogene IT-Landschaft zur Verfügung.

Industriepartner

Compute Power

High-RAM Multicore Machines

  • HPE DL980 (80 CPU cores, 2 TiB RAM)

  • HPE DL560 (80 CPU cores, 1.5 TiB RAM)

Distributed Computing

  • Compute cluster
    • Each Node has 12 CPU cores, 128/256 GiB RAM

  • HPE Moonshot
    • 10 cartridges
    • Each 8 cores, 64 GiB RAM

Virtual Machines

  • 3 Node Virtual Machine Cluster
    • Each Node has 48 CPU cores, 1 TiB RAM

GPU Power

Nvidia K GPU

  • K20/K80 (HPE/SuperMicro)

Nvidia DGX-1

  • Tesla V100
  • 1000 Terraflop
  • 40960 Cores

Storage and Backup

HP 3PAR (as part of HP CC)

  • ~100 TiB Storage

Infrastructure

10G/40G interconnect

  • 10G Server and Storage connection
  • Core switch with 40G Router interconnect
  • Internet uplink via X-WiN of DFN (German Research Network)

SAP HANA

We offer single HANA installations on shared hardware. For these purposes we have the following hardware available:

Fujitsu RX900 S1

  • CPU: 8 x Xeon X7560
  • RAM: 1024 GB
  • HDD: 6 x 900 GB
  • SSD: Fusion-io ioDimm3, 1280 GB

Hewlett Packard DL980 G7

  • CPU: 4 x Xeon (Nehalem EX) X7560
  • RAM: 1024 GB
  • HDD: 2 x 300 GB
  • SSD: Fusion-io ioDimm3, 1280 GB